VANCOUVER, British Columbia and AUSTIN, Texas, April 30, 2024 (GLOBE NEWSWIRE) -- Inspire Semiconductor Holdings Inc. (TSXV:INSP) ("InspireSemi" or the "Company"), a chip design company that provides revolutionary high-performance, energy-efficient accelerated computing solutions for High Performance Computing (HPC), AI, graph analytics, and other compute-intensive workloads, today announced that it has received an additional loan of US$300,000 (the "Loan") under the secured loan agreement (the "Loan Agreement") dated March 28, 2024 and previously announced by the Company in its press release dated April 1, 2024. The Loan was made by an arm's-length investor (the "Lender"). The maturity date of the Loan is the date that is 12 months following the date that such Loan is received by the Company (the "Maturity Date"), being April 29, 2025. All other terms of the Loan remain the same as reported in the Company's press release dated April 1, 2024. The Company will, subject to the approval of the TSX Venture Exchange (the "Exchange"), issue a total of 32,803 Bonus Warrants to the Lender. Each Bonus Warrant is exercisable for one proportionate voting share of the Company ("PV Shares") at a price per PV Share $12.50 and will have a term expiring one year from the date of issuance. All issued Bonus Warrants (and PV Shares issued upon exercise of Bonus Warrants) are subject to a hold period of four months and one day from the date of issuance, in accordance with applicable securities laws. For clarity, each PV Share issued upon exercise of a PV Warrant will be convertible into 100 SV Shares at the option of the holder and upon the terms outlined in the Company's articles available as Schedule "A" to the Company's management information circular dated August 14, 2022 which is available on SEDAR+ at www.sedarplus.ca. The Loan and the issuance of Bonus Warrants are subject to the approval of the Exchange. About InspireSemi InspireSemi (TSXV:INSP) provides revolutionary high-performance, energy-efficient accelerated computing solutions for High-Performance Computing (HPC), AI, graph analytics, and other compute-intensive workloads. The Thunderbird ‘supercomputer-cluster-on-a-chip' is a disruptive, next-generation datacenter accelerator designed to address multiple underserved and diversified industries, including financial services, computer-aided engineering, energy, climate modeling, and life sciences & drug discovery. Based on the open standard RISC-V instruction ...